Sign In | Join Free | My himfr.com
himfr.com

Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

Active Member

4 Years

Home > Ultra Soft Thermal Pad >

Multiscene Laptop CPU Thermal Pad

    Buy cheap Multiscene Laptop CPU Thermal Pad from wholesalers
     
    Buy cheap Multiscene Laptop CPU Thermal Pad from wholesalers
    • Buy cheap Multiscene Laptop CPU Thermal Pad from wholesalers
    • Buy cheap Multiscene Laptop CPU Thermal Pad from wholesalers

    Multiscene Laptop CPU Thermal Pad

    Ask Lasest Price
    Brand Name : AOK
    Model Number : UTP100
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15working days
    • Product Details
    • Company Profile

    Multiscene Laptop CPU Thermal Pad

    Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation

    AttributeValueTest Method
    CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
    ColorWhite and Brick RedVisual
    Thickness(mm)0.5~12.0ASTM D374
    Density(g/cc)2.5ASTM D792
    Hardness(shore oo)30±5ASTM D2240
    Tensile Strength(KN/m)2.5ASTM D624
    Elongation(%)60ASTM D412
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥7.0ASTM D149
    Dielectric Constant(@10mhz)5.7ASTM D150
    Volume Resistivity(Ω.cm)1.0*1013ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

    Product feature:

    ■ Thermal Conductivity:1.0 W/m.K
    ■ Ultra soft and highly compliant
    ■ Naturally tacky on one side
    because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;
    ■ High breakdown voltage
    ■ High Tear Strength 2.5 kN /m
    the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;


    Typical applications:
    ■ Networking and Telecommunications
    ■ IT: Industrial: LEDs, Power Supplies and Conversion
    ■ Consumer Electronics: Gaming Systems, and LCDs


    Purchase information:


    Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm


    Multiscene Laptop CPU Thermal Pad

    Quality Multiscene Laptop CPU Thermal Pad for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Aochuan Technology Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)