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Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

Shenzhen Aochuan Technology Co., Ltd
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    Buy cheap Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material from wholesalers
     
    Buy cheap Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material from wholesalers
    • Buy cheap Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material from wholesalers
    • Buy cheap Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material from wholesalers

    Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

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    Brand Name : AOK
    Model Number : TP
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15 working days
    • Product Details
    • Company Profile

    Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

    8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger


    AttributeValueTest Method
    CompositionCeramic Filler + Silicone-
    ColorPinkVisual
    Thickness(mm)0.5~10astm d374
    Density(g/cc)3.35ASTM D792
    Hardness(shore oo)55±10ASTM D2240
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)>6.0ASTM D149
    Dielectric Constant(@10mhz)7.2ASTM D150
    Volume Resistivity(Ω.cm)1012ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)8.0±0.5ASTM D5470


    Product feature
    ■ Thermal conductivity:8.0W/m.K
    ■ High thermal conductivity
    ■ Low oil permeability
    ■ High electrical insulation
    Good processing performance, convenient installation and pressing;
    It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;



    Typical applications
    ■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
    ■ Led Lighting, LCD TV, Telecom device, wireless Hub, NB, PC, power supply etc
    ■ CD ROM/DVD ROM
    ■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.


    Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

    Quality Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material for sale
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