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Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

Shenzhen Aochuan Technology Co., Ltd
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    Buy cheap Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene from wholesalers
     
    Buy cheap Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene from wholesalers
    • Buy cheap Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene from wholesalers
    • Buy cheap Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene from wholesalers

    Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

    Ask Lasest Price
    Brand Name : AOK
    Model Number : UTP100
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15working days
    • Product Details
    • Company Profile

    Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

    Ultra Soft Thermal Pad Super soft good thermal insulation with 1.0W/m.K

    AttributeValueTest Method
    CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
    ColorWhite and Brick RedVisual
    Thickness(mm)0.5~12.0ASTM D374
    Density(g/cc)2.5ASTM D792
    Hardness(shore oo)30±5ASTM D2240
    Tensile Strength(KN/m)2.5ASTM D624
    Elongation(%)60ASTM D412
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥7.0ASTM D149
    Dielectric Constant(@10mhz)5.7ASTM D150
    Volume Resistivity(Ω.cm)1.0*1013ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

    Product feature:
    the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
    thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
    ■ Naturally tacky on one side
    ■ High cut through resistance
    ■ High breakdown voltage
    ■ High Tear Strength 2.5 kN /m
    ■ Elongation 60%


    Typical applications:
    ■ Networking and Telecommunications
    ■ IT: Notebooks, Tablets, Power Conversion
    ■ IT: Industrial: LEDs, Power Supplies and Conversion
    ■ IT: Automotive: Control Modules, Turbo Actuators
    ■ Consumer Electronics: Gaming Systems, and LCDs


    Purchase information:


    Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm


    Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene

    Quality Electronics CPU Ultra Soft Thermal Pad Anti Insulation Multiscene for sale
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