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Shenzhen Aochuan Technology Co., Ltd

Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

    Buy cheap Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K from wholesalers
     
    Buy cheap Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K from wholesalers
    • Buy cheap Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K from wholesalers
    • Buy cheap Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K from wholesalers

    Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

    Ask Lasest Price
    Brand Name : AOK
    Model Number : UTP100
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15working days
    • Product Details
    • Company Profile

    Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

    Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity

    AttributeValueTest Method
    CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
    ColorWhite and Brick RedVisual
    Thickness(mm)0.5~12.0ASTM D374
    Density(g/cc)2.5ASTM D792
    Hardness(shore oo)30±5ASTM D2240
    Tensile Strength(KN/m)2.5ASTM D624
    Elongation(%)60ASTM D412
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)≥7.0ASTM D149
    Dielectric Constant(@10mhz)5.7ASTM D150
    Volume Resistivity(Ω.cm)1.0*1013ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

    Product feature:
    ■ Naturally tacky on one side
    ■ High breakdown voltage
    ■ High Tear Strength 2.5 kN /m
    ■ Elongation 60%

    because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;

    with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;


    Typical applications:
    ■ IT: Notebooks, Tablets, Power Conversion
    ■ IT: Automotive: Control Modules, Turbo Actuators
    ■ Consumer Electronics: Gaming Systems, and LCDs


    Purchase information:


    Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm


    Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

    Quality Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K for sale
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